Thermal paste ideal for optimizing thermal conductivity
Thermal conductivity: 12.5 W / mk
Thermal resistance: 0.0032 K / W
Electrical conductivity: * 0 pS / m
Content: 1gThe Kryonaut thermal paste was specially developed for the extremely demanding applications and the highest demands of the overlocking community. Kryonaut is also recommended as a top product for critical cooling systems in the industrial sector.

Especially for overclocking
Excellent thermal conductivity
No curing
High long-term stability
Not electrically conductive

“Kryo” – the Greek word for “cold”, which is also used in cryogenics – indicates that the Kryonaut thermal paste is especially suitable for use in the low temperature range – it was developed for the true “Kryonauts” among the “Extreme Overclockers”.”Kryo” – the Greek word for “cold”, which is also used in cryogenics – indicates that the Kryonaut thermal paste is especially suitable for use in the low temperature range – it was developed for the true “Kryonauts” among the “Extreme Overclockers”.

Kryonaut uses a special carrier structure, which does not begin any drying processes even at 80 ° C. This carrier structure ensures that the nano-aluminum and zinc oxide components contained in the paste combine optimally, thus optimally compensating for unevenness in the heat transfer medium (e.g. the CPU) and a heat sink (e.g. heat sink) with excellent thermal conductivity.

Thermal conductivity 12.5 W / mk
Thermal resistance 0.0032 K / W
Electrical conductivity * 0 pS / m
Viscosity 120-170 Pasdensity 3.7g / cm3
Temperature -250 ° C / +350 ° C
Content 1g

Model: TG-K-001-RS