Description of GD-2 High-Performance Thermal Paste (3g):
This thermal paste is designed to improve heat transfer between electronic components such as processors and heatsinks, contributing to lower temperatures and increased cooling efficiency. Here are its key features based on available information:
1. Advanced formula for improved thermal conductivity:
It contains high-quality thermal compounds that reduce thermal resistance between surfaces, ensuring even heat distribution and preventing harmful thermal buildup.
It has a low oil content, which reduces the risk of drying out over time and maintains the paste's effectiveness for longer periods.
2. Wide compatibility with components:
It is suitable for all types of heatsinks and processors (both Intel and AMD), making it an ideal choice for desktop and laptop computers.
It is also used to improve the cooling of graphics cards and some other electronic devices.
3. Ease of application and use:
The paste comes in a 3g gray bottle with a syringe for precise application and avoiding waste.
It is recommended to apply it in a "vertical line" pattern for Intel processors or a "pea-point" pattern for AMD processors to achieve optimal coverage.
4. Resistance to external factors:
It is thermally stable even under high temperatures, with resistance to corrosion and vibration.
5. Additional information:
The thermal conductivity of the paste is approximately 7.5 W/m.K, ensuring superior heat dissipation performance.
It is recommended to replace it periodically (usually every 1-3 years) depending on the intensity of use, as drying out the paste may lead to overheating of components.
Note:
The search results provided do not provide precise details regarding the brand or warranty, but the general features of the thermal paste mentioned apply to most high-quality products in this category. It is recommended to check the manufacturer's instructions to ensure proper storage and the recommended replacement interval.
